Semiconductor tester

半導体装置の検査装置

Abstract

【課題】 高密度に配置された半導体装置の半田ボール電極と測定装置の検査回路基板を良好に接続させることができると共に、高周波特性の測定に際してもインダクタンス値を低減することができる。 【解決手段】 半導体装置の半田ボール電極23と半導体試験装置の検査回路基板21とを電気的導通を生じるように接続するための導電性接触子28を用いた半導体装置の検査装置であって、導電性接触子28は、半田ボール電極23と当接し、半田ボール電極23の中心から外周に向けて広がる方向に弾性変形する第1の電極部11と、検査回路基板21の電極パッド24に当接し、電極パッド24が当接する方向に弾性変形する第2の電極部12とを有する。 【選択図】 図2
PROBLEM TO BE SOLVED: To provide a semiconductor tester capable of properly connecting a soldered ball electrode on a high-density mounted semiconductor device with a test circuit board on a measuring instrument, while reducing the inductance value even in measuring the high frequency characteristics. SOLUTION: The semiconductor tester utilizes a conductive contactor 28 served for achieving the connection through the electrical continuity between a soldered ball electrode 23 on a semiconductor device and a test circuit board 21 on the semiconductor tester. The conductive contactor 28 incorporates a primary electrode 11 which makes contact with the soldered ball electrode 23, and exhibits an elastic deformation in a widening direction from a center of the soldered ball electrode 23 toward the periphery, as well as a secondary electrode 12 which makes contact with an electrode pad 24 on the test circuit board 21 and exhibits an elastic deformation in a direction in contact with the electrode pad 24. COPYRIGHT: (C)2007,JPO&INPIT

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