樹脂接合体変形シミュレーション方法、装置、プログラムおよびこれらを用いた樹脂接合体実装システム

Resin-bonded body deformation simulation method, device, program, and resin-bonded body mounting system using these

Abstract

【課題】熱・エネルギー線硬化型樹脂の硬化進行における時間依存性を有する力学的特性の変化を考慮し、硬化過程を含む実装プロセス全体の温度条件や荷重条件等の実装条件の検討・探索を数値解析的に行うことが可能な樹脂接合体変形シミュレーション方法、装置、プログラムおよびこれらを用いた樹脂接合体実装システムを提供する。 【解決手段】樹脂の硬化収縮によって生じる、樹脂およびその他の材料から構成される樹脂接合体の構造状態の変化をシミュレーションする樹脂接合体変形シミュレーション方法であって、与えられた初期条件に基づいて樹脂接合体の温度分布を求め、求めた温度分布に基づいて樹脂の硬化反応率を求め、求めた温度分布と求めた硬化反応率とに基づいて樹脂の粘弾性特性を求め、求めた温度分布と求めた硬化反応率とに基づいて樹脂の体積変化を求め、求めた粘弾性特性と求めた体積変化とに基づいて樹脂接合体の構造状態を解析する。 【選択図】図6
PROBLEM TO BE SOLVED: To provide a resin-bonded body deformation simulation method, a device, a program, and a resin-bonded body mounting system using these, for performing study and search in a numerically analytical way on mounting conditions such as temperature conditions and load conditions on the whole of a mounting process including a curing process, in consideration of a change in time-dependent dynamic characteristics in process of the curing of a heat/energy-ray curing resin. SOLUTION: This resin-bonded body deformation simulation method is used for simulating a change in the structure state of a resin-bonded body comprising a resin and other materials, with the change caused by the curing/contraction of the resin. In this method, temperature distribution in the resin-bonded body is found based on given initial conditions, the curing reaction rate of the resin is found based on the found temperature distribution, the viscoelastic characteristic of the resin is found based on the found temperature distribution and found reaction rate, a change in volume of the resin is found based on the found temperature distribution and found reaction rate, and the structure state of the resin-bonded body is analyzed based on the found viscoelastic characteristic and found change in volume. COPYRIGHT: (C)2007,JPO&INPIT

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Cited By (2)

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    JP-2008069243-AMarch 27, 2008Nippon Avionics Co Ltd, 日本アビオニクス株式会社接着状態予測方法
    JP-2013257247-ADecember 26, 2013Dainippon Printing Co Ltd, 大日本印刷株式会社熱硬化性樹脂の硬化度を予測する方法